Plasma Dry Process Technology for High-Density Interconnection on 2D Panel Substrate Packaging

Adhesion Evaluation of Adhesiveless Metal/ Polyimide Substrate for MCM and High Density Packaging

Directly metallized polyimide films are being widely used as advanced high-density packaging substrates. Adhesion of metal to polyimide is a key performance requirement of the film. Excellent initial adhesion and good retention after severe process steps and reliability stresses are required. In this paper, the adhesion performances of films with different types of polyimide and tie layer from ...

The Application of Plasma Technology in Packaging

Throughout recent years the idea to use plasma technology to modify materials has been at the forefront. The use of plasma to sterilize packaging has become increasingly popular. Plasma has also been adopted to surface treat materials, increasing their wettability. This opens a wide variety of doors; anywhere from better printing, to bonding unlike materials during dual-injection molding. Lastl...

High-Performance FCBGA Based on Ultra-Thin Packaging Substrate

We developed a high-performance Flip-Chip Ball Grid Array (FCBGA) based on an ultra-thin, high-density packaging substrate called a Multi-Layer Thin Substrate (MLTS) in order to meet the high demand for high-density, high-performance, and low-cost LSI packages. The most important feature of the package is that it has a high-density, high-performance MLTS formed by removing a metal plate after m...

Plasma Process on Ionic Liquid Substrate for Morphology Controlled Nanoparticles

Challenges in Interconnection and Packaging

Integrated circuit packaging and their testing is well advanced because of the maturity of the IC industry, their wide applications, and availability of industrial inhstructure. [ 1,2] This is not true for MEMS with respect to packaging and testing. It is more difficult to adopt standardized MEMS device packaging for wide applications although MEMS use many similar technologies to IC packaging....